Louis Bertrand;Xiaoming Jin;Paul D. Hammesfahr;Michael T. O'Connor;Bernard Koltisko;Qizhou Dai
发明人:
Xiaoming Jin,Louis Bertrand,Qizhou Dai,Michael T. O'Connor,Paul D. Hammesfahr,Bernard Koltisko,Michael T. OConnor
申请号：
US13098508
公开号：
US09155685B2
申请日:
2011.05.02
申请国别(地区):
US
年份:
2015
代理人:
摘要：
Disclosed herein are low viscosity and low stress dental compositions comprising at least one low stress polymerizable resin and at least one filler. The dental compositions described herein have high depth of cure and self-leveling characteristics and are capable of bulk application.
