脆性基板の分断方法

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专利权人:

三星ダイヤモンド工業株式会社

发明人:

曽山 浩

申请号：

JP20160523383

公开号：

JP6288259(B2)

申请日:

2015.04.22

申请国别(地区):

日本

年份:

2018

代理人:

摘要：

A cutting edge (51) is slid across the surface (SF1) of a brittle substrate (4) so as to cause plastic deformation and form a trench line (TL). The step in which said trench line (TL) is formed is performed in such a manner so as to produce a crack-free state in which, directly underneath the trench line (TL), the brittle substrate (4) is connected in a continuous fashion in a direction that intersects the trench line (TL). Next, a film (21) that at least partially covers the trench line (TL) is formed on the surface (SF1) of the brittle substrate (4), and a crack is then made to extend along the trench line (TL), forming a crack line (CL).

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/