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電気抵抗薄膜層の成膜方法および銅張積層板の製造方法
专利权人:
住友金属鉱山株式会社
发明人:
浅川 吉幸
申请号:
JP20130184721
公开号:
JP6281215(B2)
申请日:
2013.09.06
申请国别(地区):
日本
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a film deposition method capable of improving the peel strength of an interface between a metal and a resin in a thin film having a resistive layer on at least one surface of a thermoplastic resin film.SOLUTION: The film deposition method of an electrical resistance thin film layer on the surface of a thermoplastic resin film comprises: forming the electrical resistance thin film layer without interposing an adhesive on at least one of surfaces of the thermoplastic resin film; and heating the electrical resistance thin film layer by microwave irradiation so that the temperature of the electrical resistance thin film layer by the heating is between a heating lower limit temperature determined at a glass transition point and a heating upper limit temperature determined by adding one third of the temperature of a difference between the glass transition point and melting point of the thermoplastic resin film, to the glass transition point.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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