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電気抵抗薄膜層の成膜方法および銅張積層板の製造方法
专利权人:
住友金属鉱山株式会社
发明人:
浅川 吉幸
申请号:
JP20130184719
公开号:
JP6264530(B2)
申请日:
2013.09.06
申请国别(地区):
日本
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a deposition method for enhancing the peel strength of a metal-resin interface, in a thin film having a resistive layer on at least one side of a thermoplastic resin film.SOLUTION: After depositing an electric resistance layer at least on one side of a thermoplastic resin film without interposing an adhesive, electrification heating of the electric resistance thin film layer is performed by feeding a current thereto. Heating is performed so that the electric resistance thin film layer has a temperature between a heating lower limit temperature determined by the glass transition point and a heating upper limit determined by adding 1/3 of the difference, obtained by subtracting the glass transition point from the melting point of the electric resistance thin film layer, to the glass transition point.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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