PROBLEM TO BE SOLVED: To provide a suitable connection structure according to an electric wire and an electronic component within a projection area range of an image pick-up device viewed from a tip side, minimize an outer shape and cubic volume, and reduce an outer diameter.SOLUTION: An imaging unit for an endoscope includes: a plurality of parallel electric wires； an image pick-up device disposed on a tip side of the respective electric wires separately from the tips of them, whose light incident surface substantially orthogonal to the electric wires is directed to the tip side； a flexible substrate disposed between the electric wires and the image pick-up device to form a circuit, in which the respective electric wires are conducted to the circuit； an image pick-up device mounting peninsular portion bent relative to the substrate for mounting the image pick-up device, which is conducted to the circuit: and a circuit mounting peninsular portion extending from the substrate and disposed bent on a side opposite to the image pick-up device with the image pick-up device mounting peninsular portion interposed for mounting an electric component or a circuit pattern, which is conducted to the circuit.SELECTED DRAWING: Figure 3COPYRIGHT: (C)2020,JPO&INPIT【課題】先端側から見た撮像素子の投影面積範囲内に、電線と電子部品とに応じて適した接続構造を得て、外形や体積を最小化して、外径を小径化する。【解決手段】内視鏡用撮像ユニットにおいて、複数本の平行な電線と、それぞれの電線の先端から離間して先端側に配置され、電線に略直交する光入射面が先端側に向く撮像素子と、電線と撮像素子との間に配置されて回路が形成され、それぞれの電線を回路に導通させて可撓性を有した基板と、基板に対して曲げられ、回路に導通させて撮像素子を実装する撮像素子実装半島部と、基板から延出して撮像素子実装半島部を挟んで撮像素子と反対側に曲げられて配置され、回路に導通させて電子部品もしくは回路パターンを実装する回路実装半島部と、を設けた。【選択図】図３
