PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board having high dimensional accuracy; and provide a circuit board manufacturing device.SOLUTION: A circuit board manufacturing method comprises: a process (step S2) of forming a first alignment mark 91 on a reference work-piece 90 by a gravure offset printer 70; a process (step S6) of facing the reference work-piece 90 with an insulating substrate 110 where a second alignment mark 111 is previously formed; a process (step S8) of detecting a difference A between a position of the first alignment mark 91 and a position of the second alignment mark 111; a process (step S9) of extending the insulating substrate 110 based on the difference A; and a process (step S10) of forming an electronic component 120 on the insulating substrate 110 by the gravure offset printer 70.SELECTED DRAWING: Figure 8
