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ULTRASONIC DEVICE, ULTRASONIC MODULE, AND ULTRASONIC MEASURING DEVICE
专利权人:
Seiko Epson Corporation
发明人:
Hiromu MIYAZAWA,Hiroshi ITO,Tomoaki NAKAMURA,Masayoshi YAMADA,Kanechika KIYOSE,Tsukasa FUNASAKA
申请号:
US15681883
公开号:
US20180059067A1
申请日:
2017.08.21
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and closes the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and that is sandwiched between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and that is sandwiched between a pair of electrodes in an intersecting direction intersecting with the thickness direction of the substrate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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