PROBLEM TO BE SOLVED: To provide a thermosetting resin powder composition which sufficiently reduces adhesion to a processing apparatus and a molding apparatus and is capable of producing a tablet with high mechanical strength, and to provide a thermosetting resin tablet molded using the same.SOLUTION: The present invention provides the thermosetting resin powder composition containing (A) an epoxy resin, (B) a curing agent, (C) a white pigment, and (D) a water-repellent powder. The epoxy resin (A) contains an epoxy resin having a weight-average molecular weight of 500-5,000, and the curing agent (B) contains an acid anhydride curing agent having a weight-average molecular weight of 500-5,000.SELECTED DRAWING: None
