An ultrasound probe and method for using the same are described. In one embodiment, the ultrasound probe comprises: a probe array assembly having a probe tip； a first enclosure disposed around a portion of the probe array assembly, where the first enclosure has first and second openings and comprises a thermally conductive material； and one or more thermally conductive fins contained within the first enclosure, each of the one or more thermally conductive fins having one end enclosed within the probe array assembly and a portion extending away from the probe array assembly and in thermal contact with an inner surface of the first enclosure to create a thermal path from the first opening to the second opening in the first enclosure.
