PROBLEM TO BE SOLVED: To provide a wiring board capable of obtaining a small imaging device having a wiring board arranged between components such as an imaging element chip and the like and a wiring cable.SOLUTION: A wiring board 10 has a plurality of wiring layers 22 and a plurality of insulating layers 23, and is a multilayer substrate incorporating an electronic component 21. The wiring board 10 has an electrode member 20 having an exposed part 20S on vertical lateral faces 13 and 14 that intersect with the plurality of wiring layers 22 and the plurality of insulating layers 23, and being incorporated in a state that a plating film is formed on its surface, and being made of a conductive material.COPYRIGHT: (C)2012,JPO&INPIT【課題】撮像素子チップ等の部品と配線ケーブルとの間に配設される配線板を具備する小型の撮像装置を実現できる配線板を提供する。【解決手段】配線板10は、複数の配線層22と、複数の絶縁層23とを有し、電子部品21が内蔵された多層基板であって、複数の配線層22および複数の絶縁層23と交差する垂直の側面13、14に露出部20Sを有し、表面にめっき膜が形成された状態で内蔵された、導電材料からなる電極部材20を具備する。【選択図】図2
