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Process for preparing, prior to filling, a wafer cornet, cornet thus obtained and installation for implementing the process
专利权人:
Nestec S.A.
发明人:
Alain Daouse,Christian Jean Marie Mange
申请号:
US13901192
公开号:
US08789489B2
申请日:
2013.05.23
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Process for preparing a cornet consisting of a substantially conical wafer (22) prior to filing of said cornet with an ice-cream; in order to preserve the crunchy nature of the wafer, the inner wall of the cornet is sprayed with liquid chocolate (23); this chocolate solidifies rapidly in order to form a coating layer for separating the wafer and the ice-cream. The process is characterized in that the inside of the cornet is sprayed with an excess quantity of chocolate to guarantee that no coating-gap zone remains on the inner wall of the wafer, the excess liquid chocolate collecting, under gravity, at the bottom tip of the corner, prior to solidification of said excess, the excess is sucked out of the cornet, subsequent solidification of the coating layer thus making it possible to establish a continuous barrier over the inner wall or the wafer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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