An image pickup apparatus for an endoscope of the present invention includes a first circuit board on which a lead portion, a window portion in which a part of the lead portion is exposed, and a second circuit board on which a circuit pattern is fixed by soldering to the lead portion exposed on the window portion, and the lead portion that is exposed on the window portion extends from one end side of the window portion to the other end side, and has an enlarged end portion of the lead portion that is placed between two or more insulating layers and is formed with a larger width than a width of the lead portion in the window portion, at the other end side.
