PROBLEM TO BE SOLVED: To provide a compact imaging device and an endoscope which are simple in structure, can improve assemblability into an inside of a distal end hard part of a small diameter distal end part, and can radiate heat generated by a semiconductor element.SOLUTION: An imaging device 1 has: an imaging element 2 having a light receiving surface on a surface 2A a plurality of electronic components 3, 4 electrically connected to the imaging element 2 a first flexible board 5 which mounts the plurality of electronic components 3, 4 on both surfaces, extends in the direction away from a reverse surface 5B of the imaging element 2, and is placed on the reverse surface side of an extending imaging element 2 and connection means which has a first terminal part connected to an input/output terminal of the imaging element 2 and a second terminal part disposed on the distal end side opposite to a joint surface to the first flexible board 5 of the electronic component 3.COPYRIGHT: (C)2014,JPO&INPIT【課題】簡単な構成で、細径の先端部の先端硬質部内への組立性を向上することができ、半導体素子により発した熱を放熱することができる小型の撮像装置及び内視鏡を実現する。【解決手段】本発明に係る撮像装置1は、表面2Aに受光面を有する撮像素子2と、撮像素子2に電気的に接続される複数の電子部品3、4と、複数の電子部品3、4を両面に搭載し、撮像素子2の裏面5Bから離間する方向に延出し撮像素子2の裏面側に配置される第1フレキシブル基板5と、撮像素子2の入出力端子に接続される第1の端子部および電子部品3の第1フレキシブル基板5との接合面と反対面の先端側に配設された第2の端子部を有する接続手段と、を有する。【選択図】図1
