An imaging unit, an imaging module, and an endoscope which are excellent in connection reliability while reducing the diameter are provided. The image pickup unit 10 according to the present invention comprises a prism 40 for condensing light, a semiconductor package 20 having an image pickup device 21 and having connection electrodes formed on the back surface, a plurality of cables 60 a and 60 b, a plurality of electronic components 51 , 52, a first electrode and a second electrode are arranged side by side on the surface, and third electrodes 32 a, 32 b on which the electronic components 51, 52 are mounted on the back surface f 4 are arranged in a rectangular plate shape And the laminated substrate 30 has wall portions 33-1 and 33-2 on at least two opposing sides of the back surface f 4, and the semiconductor package 20 has the light receiving surface of the image pickup device 21 And is placed horizontally.細径化を図りながら、接続信頼性の優れる撮像ユニット、撮像モジュールおよび内視鏡を提供する。本発明における撮像ユニット10は、光を集光するプリズム40と、撮像素子21を有し、裏面に接続電極が形成された半導体パッケージ20と、複数のケーブル60a、60bと、複数の電子部品51、52と、矩形板状をなし、表面に第1の電極と、第2の電極とが並べて配置されるとともに、裏面f4に電子部品51、52が実装される第3の電極32a、32bが形成された積層基板30と、を備え、積層基板30は、裏面f4の少なくとも対向する2辺に壁部33-1、33-2を有し、半導体パッケージ20は、撮像素子21の受光面が水平に載置されることを特徴とする。
