The imaging device 1 is provided with an imaging element 10 having an external electrode 12 electrically connected to the light receiving unit 11 and a first bonding electrode 41 joined to the external electrode 12 of the imaging element 10. An imaging device 1 including a wiring board having a wiring portion 40Z, wherein the first main surface 40SA of the wiring portion 40Z is disposed at a first angle θ1 of 90 degrees or less with respect to the opposing surface 10SB. The wiring board 40 includes a reinforcing portion 40X and a bent portion 40Y that is bent at a first angle θ1 between the reinforcing portion 40X and the wiring portion 40Z, and the second main surface 40SB of the reinforcing portion 40X is It is fixed to the facing surface 10SB.撮像装置１は、受光部１１と接続されている電気的に外部電極１２を有する撮像素子１０と、撮像素子１０の外部電極１２と接合されている第１の接合電極４１が配設されている配線部４０Ｚを有する配線板と、を含む撮像装置１であって、配線部４０Ｚの第１の主面４０ＳＡが対向面１０ＳＢに対して９０度以下の第１の角度θ１に配置されており、配線板４０が、補強部４０Ｘと、補強部４０Ｘと配線部４０Ｚとの間の第１の角度θ１で曲がっている折り曲げ部４０Ｙと、を有し、補強部４０Ｘの第２の主面４０ＳＢが対向面１０ＳＢに固定されている。
