An electromedical implant, having a housing with three housing segments A, B and C. Segment A is joined to segment B, and segment B is joined to segment C, so that segment B is disposed between segments A and C. Segment A and segment C are at least partially made of electrically conducting material. Furthermore, an electronics module is disposed within housing segment A and has an electric circuit arrangement for picking up and further processing electrical signals, and at least one first and one second electrical conductor for measuring electrical potentials and/or for delivering electric pulses. Each conductor has a conductor start and a conductor end, and each conductor start is connected to the electric circuit arrangement. An electrical feedthrough is at least partially made of electrically insulating material, and segment B is formed by portions of the feedthrough.
