Tim BORETIUS,Fabian KIMMIG,Christina Sebastian HASSLER,Dennis PLACHTA
申请号：
US16461656
公开号：
US20190351214A1
申请日:
2017.11.17
申请国别(地区):
US
年份:
2019
代理人:
摘要：
An implantable electrical contact arrangement is described which has at least one electrode body arrangement composed otherwise entirely of biocompatible, electrically insulating material, with at least one freely accessible electrode surface enclosed directly or indirectly by the biocompatible electrically insulating material. The invention is characterized in that the electrode body arrangement has a stack-shaped layer composite which provides at least one gold layer connected to an iridium layer via a diffusion barrier layer. The stack-shaped layer composite is otherwise completely encapsulated by an SiC layer, with the exception of at least one surface region of the iridium layer directed away from the layer composite. The SiC layer has an SiC layer surface which is directed away from the stack-shaped layer composite and which is adjoined directly or indirectly by the biocompatible, electrically insulating material.
