A photosensitive transfer material including a support and a photosensitive resin composition layer, in which the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B), and the photosensitive resin composition layer does not have an ethylenic crosslinking structure is a positive-type material, is excellent in terms of heat-resistant rectangular properties, etchant resistance, and resist peeling properties, and generates only a small amount of dust during processes; a pattern formation method, and an etching method.
