A semiconductor module capable of effectively downsizing is provided. A semiconductor module includes a solid-state imaging device having a light-receiving surface on which a light-receiving unit is disposed, and a back surface disposed on a second main surface on the opposite side of the light-receiving surface of the solid-state imaging device. The hard substrate 10 disposed opposite to the electrode 8 and the second main surface 32 of the solid-state imaging device 4 and electrically connected to the back electrode 8, and the first main surface 40 side of the hard substrate 10 The formed step portion 42, the electronic component 14 accommodated in the step portion 42, the recess 58 formed in the second main surface 48 of the hard substrate 10, and the lead arranged so that one end is inserted into the recess 58. And an extraction electrode 18 for electrically connecting the wires. [Selection] Figure 2【課題】効果的に小型化を図ることができる半導体モジュールを提供する。【解決手段】半導体モジュール２は、受光部２４が配置された受光面２６を有する固体撮像素子４と、固体撮像素子４の受光面２６と反対側の第２の主面３２に配置された裏面電極８と、固体撮像素子４の第２の主面３２に対向して配置され、且つ、裏面電極８と電気的に接続された硬質基板１０と、硬質基板１０第１の主面４０側に形成された段差部４２と、段差部４２に収容された電子部品１４と、硬質基板１０の第２の主面４８に形成された凹部５８と、凹部５８に一端を挿入するように配置したリード線を電気的に接続するための引き出し用電極１８とを備える。【選択図】図２
