SATO TAKAO,佐藤 貴夫,SHIROYA HIDEO,白谷 英雄,OISHI WATARU,大石 亘
申请号：
JP2018072588
公开号：
JP2019180603A
申请日:
2018.04.04
申请国别(地区):
JP
年份:
2019
代理人:
摘要：
To provide an imaging unit capable of easily achieving reduction of a hard part length including a solid state imaging device.SOLUTION: There is provided an imaging unit 10 having a solid state imaging device 20 and a coaxial cable 40 electrically connected to an electrode pad 24 on a rear face 23 opposite to a front face where an imaging surface of the solid state imaging device is located. An external conductor assembled wire part 42b in which a plurality of wires 42a of an external conductor 42 are assembled from the front end of an external insulation layer 44 of the coaxial cable 40, and an internal coated wire 45 are extended in mutually different directions. A central conductor front side extension part 41b extended from an insulation layer front end of the internal coated wire 45 and the external conductor assembled wire part 42b are connected to an electrode pad 24 provided to a solid state imaging device rear face while being separated from each other.SELECTED DRAWING: Figure 1【課題】固体撮像素子を含む硬性部長の短縮を容易に実現できる撮像ユニットの提供。【解決手段】固体撮像素子２０と固体撮像素子の撮像面が位置する前面とは逆の後面２３の電極パッド２４に電気的に接続された同軸ケーブル４０とを有し、同軸ケーブル４０の外部絶縁層４４前端から外部導体４２の素線４２ａが複数集合された外部導体集合線部４２ｂと内部被覆線４５とが互いに異なる方向に延出され、内部被覆線４５の絶縁層前端から延出された中心導体前側延出部４１ｂと外部導体集合線部４２ｂとが固体撮像素子後面に互いに離隔させて設けられた電極パッド２４に接続されている撮像ユニット１０を提供する。【選択図】図１
