An image pickup apparatus includes a solid-state image pickup device chip 32, an FPC 43 whose terminals are connected to the solid-state image pickup device chip 32, and a plurality of electronic components 70, 71, and 72 mounted on a front surface 43i of the FPC 43, wherein behind a back face 32h of the solid-state image pickup chip 32, the FPC 43 is disposed by being folded in such a way that the FPC 43 will provide mounting surfaces for the plurality of electronic components 70, 71, and 72 in a plurality of layers and that the plurality of electronic components 70, 71, and 72 will be superimposed via the FPC 43.
