An object of the present invention is to provide a plasma treatment method in which a surface of a lengthy object to be treated can be uniformly and evenly subjected to surface treatment by the lengthy object to be treated being selectively passed through an area having high plasma density, within plasma of which density distribution is varied, and a plasma treatment apparatus that uses the plasma treatment method and has excellent operability.In a plasma treatment method for subjecting a lengthy obj ect to be treated W to plasma treatment by placing the lengthy object to be treated W in contact with plasma, density distribution of plasma is varied. The plasma treatment method subjects the lengthy object to be treated W to plasma treatment while selectively passing the lengthy object to be treated W through an area having high plasma density. The invention also relates to a plasma treatment apparatus using the plasma treatment method, and a lengthy object that has been subjected to plasma treatment.
