The image pickup apparatus includes a plurality of functional regions, each of which has one solid-state image pickup element, a plurality of electronic components, a signal cable, a first surface and a second surface, and is formed into a predetermined shape in an unfolded state A flexible substrate having a plurality of bent portions, one image pickup element mounting area which is one of functional areas and is set to a predetermined surface shape in a rectangular shape on which the solid-state image pickup device is mounted, a function One of the regions, one of the electronic parts is mounted, at least two of the electronic parts are mounted, which are folded at the bending part and arranged parallel to the imaging element mounting region and are contained within the projected area of the imaging element mounting region An electronic component mounting region and a wiring which is one of functional regions and is provided between adjacent mounting regions of the flexible substrate and electrically connects electronic parts of adjacent mounting regions, By being folded, an electron And at least one wiring region in which the product mounting regions are arranged in parallel and accommodated in the projected area of the imaging element mounting region together with the electronic component mounting region, As the surface shape of the mounting area is the maximum and the lengths of at least a pair of opposing sides in each surface shape become stepwise shorter as they are separated from the imaging device mounting area.撮像装置は、1つの固体撮像素子と、複数の電子部品と、信号ケーブルと、第1面と第2面とを有し、展開状態において予め定めた形状に形作られた、複数の機能領域と複数の曲げ部とを有する可撓性基板と、機能領域の1つであって、固体撮像素子が実装される矩形形状で予め定めた面形状に設定された1つ撮像素子実装領域と、機能領域の1つであって、電子部品のいずれかが実装される、曲げ部で折り畳まれて撮像素子実装領域に対して平行に配置されて撮像素子実装領域の投影面積内に収められる少なくとも2つの電子部品実装領域と、機能領域の1つであって、可撓性基板の隣り合う実装領域の間に設けられて、隣り合う実装領域の電子部品同士を電気的に接続する配線を有し、折り畳まれることで撮像素子実装領域に対して電子部品実装領域を平行に配置し、且つ、撮像素子実装領域の投影面積内に電子部品実装領域と共に収められる少なくとも1つの配線領域と、を有し、積層配置された複数の機能領域は、撮像素子実装領域の面形状が最大で、撮像素子実装領域から離間するにしたがって各
