An image pickup apparatus includes: one solid-state image pickup element； a plurality of electronic components； a signal cable； a flexible substrate that has a first surface and a second surface, that is formed in a predetermined shape in an unfolded state, and that has a plurality of functional regions and a plurality of bending portions； one image-pickup-element mounting region that is one of the functional regions, is configured with a predetermined surface shape having a rectangular shape, and on which the solid-state image pickup element is to be mounted； at least two electronic-component mounting regions that are each one of the functional regions, on which any of the electronic components is to be mounted, and that, when the flexible substrate is folded at the bending portions, are arranged parallel to the image-pickup-element mounting region and are included in the projected area of the image-pickup-element mounting region； and at least one wiring region that is one of the functional regions, is provided between adjacent mounting regions of the flexible substrate, has wiring for electrically connecting electronic components in the adjacent mounting regions, and that, when the flexible substrate is folded, causes the electronic-component mounting regions to be arranged parallel to the image-pickup-element mounting region, and is included in the projected area of the image-pickup-element mounting region together with the electronic-component mounting regions. When the plurality of functional regions are stacked in layers, the image-pickup-element mounting region has the largest surface shape, and the length of at least a pair of opposing sides of the surface shapes decreases, in stages, with increasing distance from the image-pickup-element mounting region.L'invention concerne un appareil de capture d'image qui comprend : un élément de capture d'image à semi-conducteurs； une pluralité d'éléments électroniques； un câble de signal； un substrat souple qui a une p
