An image pickup apparatus includes a solid-state image pickup device chip, an FPC whose terminals are connected to the solid-state image pickup device chip, and a plurality of electronic components mounted on a front surface of the FPC, wherein behind a back face of the solid-state image pickup device chip, the FPC is disposed by being folded in such a way that the FPC will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the plurality of electronic components will be superimposed via the FPC.
