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Au−Sn合金含有ペースト、Au−Sn合金薄膜及びその成膜方法
专利权人:
三菱マテリアル株式会社
发明人:
石川 雅之,山本 佳史
申请号:
JP20120200355
公开号:
JP6070927(B2)
申请日:
2012.09.12
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a uniform and thin Au-Sn alloy thin film, while securing excellent bondability as a joint layer by an Au-Sn alloy on a metallization layer of an LED element or a substrate.SOLUTION: Screen printing is executed in a predetermined area on the metallization layer of Au, by using Au-Sn including alloy paste of mixing Au-Sn alloy powder including Sn:20-25 wt%, having a residual part having a composition composed of Au and having a particle size of 10 μm or less and an RA flux of 15-30 wt%, and next, the Au-Sn alloy thin film having a thickness of 5 μm or less and having at least an eutectic structure, is formed by being solidified after heating and melting the Au-Sn alloy powder.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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