An endoscope device comprises an image capturing unit, a supporting unit, a first and a second coaxial conductive units, and a conductive glue. The image capturing unit has a sensing surface and a back surface with at least two conductive pads thereon. The supporting unit has at least two carrying portions corresponding to the at least two conductive pads respectively. The supporting unit is connected with the back surface of the image capturing unit and extends along a direction approximately orthogonal to the back surface. The first and second coaxial conductive units are located at corresponding carrying portions respectively. The conductive glue covers the first coaxial conductive unit and the conductive pad corresponding to the first coaxial conductive unit, and covers the second coaxial conductive unit and the conductive pad corresponding to the second coaxial conductive unit
