PROBLEM TO BE SOLVED: To protect an outer peripheral side surface of an insulating layer to prevent damage of the insulating layer, and to improve humidity resistance by preventing infiltration of moisture via the insulating layer, and thereby, to provide an imaging device having a high reliability.SOLUTION: An imaging device comprises: a substrate 2 in which a light receiving part 3 and a peripheral circuit part 4 are formed on a first surface 2i a multilayer wiring layer 7 laminated on the first surface 2i, and having a plurality of metal layers 6 and an insulating layer 5 a light transmissive cover 10 located on the multilayer wiring layer 7 and a lateral face encapsulation member 10z protecting an outer peripheral side surface 5g of the multilayer wiring layer 7 by watertight abutment of an extended end 10ze, which is extended from a circumference part of a surface 10t in the light transmissive cover 10 so as to have a frame-like part at the substrate 2 side, on a region 2v where no multilayer wiring layer 7 is formed on the first surface 2i of the substrate 2.COPYRIGHT: (C)2014,JPO&INPIT【課題】絶縁層の外周側面を保護することにより、絶縁層の損傷を防ぐとともに絶縁層を介した水分の浸入を防止することで耐湿性を向上させることによって、信頼性の高い撮像装置を提供する。【解決手段】受光部3と周辺回路部4とが第1の面2iに形成された基板2と、第1の面2i上に積層された、複数の金属層6と絶縁層5とを有する多層配線層7と、多層配線層7上に位置する透光性カバー10と、透光性カバー10における面10tの周部から基板2側に枠状を有して延出された、延出端10zeが基板2の第1の面2iにおける多層配線層7の非形成領域2vに水密に当接することにより、多層配線層7の外周側面5gを保護する側面封止部材10zと、を具備する。【選択図】図2
