An Al-Te-Cu-Zr alloy sputtering target, comprising 20 at% to 40 at% of Te, 5 at% to 20 at% of Cu, 5 at% to 15 at% of Zr and the remainder of Al, wherein a Te phase, a Cu phase and a CuTe phase are not present in a structure of the target. An object of the present invention is to provide an Al-Te-Cu-Zr alloy sputtering target capable of effectively reducing particle generation, nodule formation and the like upon sputtering and further capable of reducing oxygen contained in the target.
