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LOW TEMPERATURE ENCAPSULATE WELDING
专利权人:
Darren James Wilson
发明人:
Darren James Wilson,Nicholas S. Ritchey,Stephen James Guy Taylor
申请号:
US13146988
公开号:
US20120010709A1
申请日:
2010.01.29
申请国别(地区):
US
年份:
2012
代理人:
摘要:
A load-bearing medical implant is disclosed that includes a load-bearing structure with a cavity extending into the outer surface of the structure. The cavity accommodates a sensor that is held in a fixed position within the cavity by an encapsulant. The cavity is covered by a plate that is welded over the cavity in close proximity to the sensor and encapsulant to provide a seal over the cavity and the electronic component without causing thermal damage to the encapsulant or sensor despite the close proximity of the encapsulant and sensor to the welded areas of the plate and structure. Methods for encapsulating the sensor in the cavity, methods for encapsulating a wire bus leading from the sensor through a channel in the implant and methods for pulsed laser welding of weld plate over the sensor and encapsulant with thermal damage to either are disclosed.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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