A device-bonded body includes: a first device where a plated bump is disposed； a second device where a bonding electrode bonded to the plated bump is disposed； and a sealing layer made of NCF or NCP, the sealing layer being disposed between the first device and the second device and including filler particles made of inorganic material； wherein a surface of the plated bump includes a first area and a second area higher than the first area； and at least a part of a side surface of an outer circumferential portion of the second area intersects with a surface of the first area.
