An endoscope includes an image pickup unit at a distal end portion of an insertion portion, the image pickup unit includes a chip part provided with a first electrode pad and a second electrode pad, an image pickup device provided with a third electrode pad and a wiring board including a flying lead, the flying lead is inserted into a gap between the chip part and the image pickup device, the first electrode pad and the flying lead are bonded together via a first bump, a bonded portion between the first electrode pad and the flying lead is sealed with first sealing resin, the second electrode pad and the third electrode pad are bonded together via a second bump which is higher than the first bump and sealed with second sealing resin having a Young's modulus lower than a Young's modulus of the first sealing resin.
