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Endoscope, electronic unit and method for manufacturing electronic unit
专利权人:
OLYMPUS CORPORATION
发明人:
Takahide Miyawaki
申请号:
US15893892
公开号:
US10356907B2
申请日:
2018.02.12
申请国别(地区):
US
年份:
2019
代理人:
摘要:
An endoscope includes an image pickup unit at a distal end portion of an insertion portion, the image pickup unit includes a chip part provided with a first electrode pad and a second electrode pad, an image pickup device provided with a third electrode pad and a wiring board including a flying lead, the flying lead is inserted into a gap between the chip part and the image pickup device, the first electrode pad and the flying lead are bonded together via a first bump, a bonded portion between the first electrode pad and the flying lead is sealed with first sealing resin, the second electrode pad and the third electrode pad are bonded together via a second bump which is higher than the first bump and sealed with second sealing resin having a Young's modulus lower than a Young's modulus of the first sealing resin.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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