An image pickup apparatus includes an image pickup device including a wiring that connects a first electrode on a light receiving surface and a second electrode on a rear surface, a first wiring board including a distal end surface, from which a flying lead protrudes, arranged to oppose the rear surface of the image pickup device, and a second wiring board including a second main surface to which an upper surface of the first wiring board is made to adhere and including a distal end surface arranged to oppose the rear surface, in which the flying lead is bent and is bonded to the second electrode, and a sealing member that seals a bonding section between the second electrode and the flying lead and an adhesion member that makes the distal end surface of the second wiring board and the rear surface adhere to each other are composed of integral curable resin.
