An endoscope includes in a distal end portion of an insertion portion, an image pickup apparatus which includes an image pickup device including a semiconductor substrate in which an image pickup section is formed on a first principal surface, the semiconductor substrate including a bonding terminal on a second principal surface, and a wiring layer that is placed on the first principal surface of the semiconductor substrate and includes a conductor layer stacked via insulating layers, and a cover glass that is bonded in such a manner as to cover an entire side of the first principal surface of the image pickup device, the endoscope including a protection section that covers at least a side surface of the wiring layer of the image pickup device, the protection section including a resin in which blocking particles are dispersed, the blocking particles having lower moisture permeability than moisture permeability of the resin.
