The present invention provides a dissolution improved solid preparation containing a compound of the following formula (I) or the pharmaceutically acceptable salt thereofA process for preparing solid preparation containing a compound of the following formula (I):or the pharmaceutically acceptable salt thereof, by a process of mixing a composition composed of a compound of the formula (I) or the pharmaceutically acceptable salt thereof, in which consists of subjecting mechanical stress to the composition.本發明提供含有如下式(I)化合物或其藥理容許鹽之改善溶出性之固形製劑之製造方法。於混合含有如下式(I)化合物或其藥理容許鹽之組成物之工程中,包括於該組成物予以機械應力之工程之含有如上式(I)化合物或其藥理容許鹽之固形製劑製造方法。
