This imaging module is equipped with: an electric cable (3) a solid-state image sensor (1) having a light-receiving surface that is perpendicular to the axial direction of the leading end of the electric cable (3) and a three-dimensional wiring substrate that has wiring formed on a surface of a molded article that extends in the axial direction, that electrically connects the electric cable (3) and the solid-state image sensor (1) via the wiring, and has a mounting surface (21a) for mounting the solid-state image sensor (1) disposed at the leading end of the molded article. The mounting surface (21a) has two vertices that face each other with a center section therebetween, and is formed such that, among the distance between the two vertices and the distance between two points on the sides of the mounting surface (21a), the distance between the two vertices is the longest. A cross section of the three-dimensional wiring substrate parallel to the mounting surface (21a) is equal to the mounting surface (21a) or is smaller than the mounting surface (21a), and the longest distance between two points on the sides of the planar shape of the solid-state image sensor (1) is shorter than or equal to the distance between the two vertices.Linvention concerne un module dimagerie, qui comprend : un câble électrique (3) un capteur dimage à semi-conducteurs (1) ayant une surface de réception de lumière qui est perpendiculaire à la direction axiale de lextrémité avant du câble électrique (3) et un substrat de câblage tridimensionnel qui a un câblage formé sur une surface dun article moulé qui sétend dans la direction axiale, qui connecte électriquement le câble électrique (3) et le capteur dimage à semi-conducteurs (1) par lintermédiaire du câblage, et qui a une surface de montage (21a) pour monter le capteur dimage à semi-conducteurs (1) disposé sur lextrémité avant de larticle moulé. La surface de montage (21a) a deux sommets qui se font mutuellement face, comprenant une section
