PROBLEM TO BE SOLVED: To provide a mounting structure, an ultrasonic device, an ultrasonic probe, an ultrasonic device, and an electronic apparatus capable of easily performing electrical connection between substrates.SOLUTION: The mounting structure comprises: a first substrate having a first surface provided with a functional element a wiring part provided at a position different from the functional element on the first surface and connected to the functional element a second substrate having a second surface opposing the first surface and a conduction part provided on the second surface, connecting with the wiring part, and connected to the functional element. The shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring part and the conduction part are connected and the second substrate.SELECTED DRAWING: Figure 4COPYRIGHT: (C)2019,JPO&INPIT【課題】基板間での電気的接続を容易に行うことができる実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器を提供する。【解決手段】実装構造体は、機能素子が設けられる第一面を有する第一基板と、第一面の機能素子とは異なる位置に設けられ、機能素子に接続される配線部と、第一面に対向する第二面を有する第二基板と、第二面に設けられ、配線部に接続し、機能素子に接続される導通部と、を備え、機能素子と第二基板との最短距離は、配線部と導通部とが接続される位置と第二基板との距離より長い。【選択図】図4
