Problem to be solved: to provide an integrated circuit substrate, a sensing device, a biological information analyzing apparatus, and a method of manufacturing an integrated circuit board for suppressing damage of wiring portions due to bending.Film substrate 4 having flexibility andDisposed above the film substrateA plurality of electronic components 5 including integrated circuits 5B andA wiring portion 6a-6e is provided between the film substrate 4 and the plurality of electronic parts 5 to electrically connect the plurality of electronic componentsThe wiring sectionsConductive conductive portions 7a-7e and low resistance conductive portions 8A to 8e are laminated and laminated.The stretchable conductive portions 7a-7e are disposed so as to extend oppositely to the film substrate 4 and have higher tensile strength than the low resistance conductive portions 8A to 8e and the film substrate 4.The low resistance conductive portions 8A to 8e have lower resistivity than the stretchable conductive portions 7a-7e and are stacked on the upper side of the stretchable conductive portions 7a-7e to be connected to a plurality of electronic parts 5.Diagram【課題】湾曲による配線部の損傷を抑制する集積回路基板、センシング装置、生体情報解析装置および集積回路基板の製造方法を提供する。【解決手段】可撓性を有するフィルム基板４と、フィルム基板４の上側に配置され、集積回路５ｂおよび５ｃを含む複数の電子部品５と、フィルム基板４と複数の電子部品５との間に配置されて複数の電子部品５を電気的に接続する配線部６ａ～６ｅとを備え、配線部６ａ～６ｅは、導電性を有する伸縮導電部７ａ～７ｅと低抵抗導電部８ａ～８ｅを積層して形成され、伸縮導電部７ａ～７ｅがフィルム基板４に対向して延びるように配置されると共に低抵抗導電部８ａ～８ｅおよびフィルム基板４より高い伸縮性を有し、低抵抗導電部８ａ～８ｅが伸縮導電部７ａ～７ｅより低い抵抗率を有すると共に伸縮導電部７ａ～７ｅの上側に積層されて複数の電子部品５に接続される。【選択図】 図２
