PROBLEM TO BE SOLVED: To provide an interior cooling structure for efficiently reducing a temperature rise inside a device due to heat generation from a variety of electronic components mounted on a plurality of boards arranged in a small space of the device resulting from downsizing.SOLUTION: The interior cooling structure 59 includes: a frame 65 in which a plurality of circuit board modules 66, 67, 68, and 69 are stacked, with electronic components mounted on the plurality of circuit board modules by being classified by function an external housing which covers the frame together with the plurality of circuit board modules a plurality of cooling devices 81, 82, and 83 which reduce temperature rises in the external housing caused by heat produced by the plurality of circuit board modules and a heat generating region (a) partitioned in such a way as to enclose the circuit board module 67 which has the highest total power consumption among the plurality of circuit board modules. The multiple cooling devices are arranged in such a way as to suppress temperature rises in the heat generating region by capacity higher than capacity of one of the cooling devices.COPYRIGHT: (C)2010,JPO&INPIT【課題】 小型化に伴い、装置内部の小さなスペースに配置した複数の基板に実装された各種電子部品からの発熱による装置内部の温度上昇を効率よく冷却することができる装置内冷却構造の実現。【解決手段】 装置内冷却構造59は、機能別に各種電子部品が実装された複数の回路基板部66、67、68、69が積層配置されるフレーム65と、複数の回路基板部と共に、フレームを覆う外装筐体と、複数の回路基板部の発熱による外装筐体内の温度上昇を抑制する複数の冷却装置81,82,83と、複数の回路基板部のうち、最も合計消費電力量の多い回路基板部67を囲むように仕切った発熱領域aと、を備え、発熱領域内の温度上昇を1つの冷却装置の能力以上で抑制するように複数の冷却装置を配置した。【選択図】 図13
