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TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PART STRUCTURE
专利权人:
MITSUBISHI MATERIALS CORPORATION
发明人:
KUBOTA, Kenji,TARUTANI, Yoshie,NAKAYA, Kiyotaka
申请号:
WO2016JP84690
公开号:
WO2017090638(A1)
申请日:
2016.11.24
申请国别(地区):
世界知识产权组织国际局
年份:
2017
代理人:
摘要:
On a substrate 2 made of copper or a copper alloy, a zinc-nickel alloy layer 4 containing zinc and nickel, and a tin layer 5 made of a tin alloy are laminated in this order, wherein the zinc-nickel alloy layer 4 has a thickness of 0.1-5 µm and has a nickel content of 5-50 mass%, the tin layer 5 has a zinc concentration of 0.6-15 mass%, and, under an oxide layer 6 which is the outermost layer, a metal zinc layer 7, having a zinc concentration of 5-40 at% and a thickness of 1-10 nm in terms of SiO2, is formed on the tin layer 5.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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