Provided are a molded circuit component which can be easily manufactured while maintaining accuracy even when miniaturized, and which is equipped with leads connectable to an external base material. Also provided are a method for manufacturing a molded circuit component, and a circuit module. A molded circuit component 10 according to the present invention, in which a three-dimensional circuit is formed by means of laser light, is provided with: a body portion 1 in which the three-dimensional circuit is formed; and a lead portion 2 which is connected to an external electrode of an external base material by soldering, and which extends from the body portion 1. The molded circuit component 10 is characterized in that the lead portion 2 includes a lead portion body molded from the same material as the body portion 1, and a metal film formed at least on a part of the outer periphery of the lead portion body.
