TENON HEAT TRANSFER TECHNOLOGY (ZHONGSHAN)CO., LTD.
发明人:
LIN, Qiongrong
申请号：
WO2015CN88810
公开号：
WO2017020390(A1)
申请日:
2015.09.02
申请国别(地区):
世界知识产权组织国际局
年份:
2017
代理人:
摘要：
Disclosed is a heat dissipation device. The heat dissipation device comprises a heat conducting disc (10) used for mounting a heat source. Several superconductive tubes (20) are disposed on the heat conducting disc (10), and a heat dissipation fin (30) is disposed on each superconductive tube (20). Each heat dissipation fin (30) comprises a heat dissipation fin body (300) whose longitudinal length is longer than the transverse width, an mounting hole (301) extending in the longitudinal direction of the heat dissipation fin body (300) is formed in the middle of the heat dissipation fin body (300), and the superconductive tube (20) is mounted in the mounting hole (301) in a penetrating mode. Therefore, in the process in which heat is transmitted from one end of the superconductive tube (20) to the other end of the superconductive tube (20), the heat is also quickly transmitted from the middle of the heat dissipation fin (30) to the edges of the two sides of the heat dissipation fin (30) and to every position of
