您的位置: 首页 > 农业专利 > 详情页

半導体の表面・界面準位を評価する方法
专利权人:
トヨタ自動車株式会社;学校法人トヨタ学園
发明人:
富田 英幹,榊 裕之,保木井 美和
申请号:
JP20140061734
公开号:
JP6066337(B2)
申请日:
2014.03.25
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a method by which the interface state density of a semiconductor interface having a structure other than an MIS structure can be obtained and by which the interface state of a semiconductor interface and the interface state of an exposed semiconductor surface can be evaluated.SOLUTION: The interface state of a first semiconductor layer 16 of a semiconductor device is evaluated, the semiconductor device having a first semiconductor layer 16 and a second semiconductor layer 20 hetero-jointed to the first semiconductor layer 16, and also having a conductive channel layer 17 formed along a hetero-joined interface 18. To evaluate an interface state, while constant electric current is caused to flow in the conductive channel layer 17 by a constant current power source, a pillar is pressed toward the semiconductor device 10, thereby applying external pressure such that the semiconductor 10 is warped. The application of the external force causes tensile stress, as shown by the arrows
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充