IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
发明人:
KIM, Hak Sung,JOO, Sung Jun,NAM, Gwon Woo
申请号：
WO2016KR03447
公开号：
WO2016163695(A1)
申请日:
2016.04.04
申请国别(地区):
世界知识产权组织国际局
年份:
2016
代理人:
摘要：
The present invention relates to a method for manufacturing a multi-layer printed circuit board using conductive copper ink and light sintering, and a multi-layer printed circuit board manufactured thereby and, more specifically, to a method for manufacturing a multi-layer printed circuit board using conductive copper ink and light sintering, and a multi-layer printed circuit board manufactured thereby, the method comprising the steps of: a) forming a via-hole on a predetermined portion of a substrate; b) manufacturing a double-sided printed circuit board by coating conductive copper ink on the upper and rear surfaces of the substrate on which the via-hole is formed, followed by drying; c) subjecting the double-sided printed circuit board to light sintering; d) laminating multiple double-sided printed circuit boards manufactured by repeating steps a) to c), and then forming a blind via-hole or a through-hole for interfacial connection; and e) performing printing and light sintering on the blind via-hole or th
