An ultrasonic transducer module may comprise: an ultrasonic transducer comprising a substrate, a thin film separated from the substrate, a support portion for supporting the thin film, and a first electrode pad on the substrate; and/or a circuit board comprising a main body, an opening in the main body for accommodating the thin film, and a second electrode pad attached to the first electrode pad. An ultrasonic transducer may comprise: a substrate; a plurality of first electrode layers on the substrate, with spaces between the first electrode layers; an insulating layer between the substrate and the first electrode layers; a support portion on the first electrode layers; a thin film supported by the support portion, with cavities between each of the first electrode layers and the thin film; and/or a second electrode layer on the thin film.