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Ultrasonic transducers and methods of manufacturing the same
专利权人:
Samsung Electronics Co.; Ltd.
发明人:
Seogwoo Hong,Dongsik Shim,Seokwhan Chung
申请号:
US14665213
公开号:
US09872120B2
申请日:
2015.03.23
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An ultrasonic transducer module may comprise: an ultrasonic transducer comprising a substrate, a thin film separated from the substrate, a support portion for supporting the thin film, and a first electrode pad on the substrate; and/or a circuit board comprising a main body, an opening in the main body for accommodating the thin film, and a second electrode pad attached to the first electrode pad. An ultrasonic transducer may comprise: a substrate; a plurality of first electrode layers on the substrate, with spaces between the first electrode layers; an insulating layer between the substrate and the first electrode layers; a support portion on the first electrode layers; a thin film supported by the support portion, with cavities between each of the first electrode layers and the thin film; and/or a second electrode layer on the thin film.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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