CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRATED CIRCUITS

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专利权人:

APPLIED Materials, Inc.

发明人:

Shaviv Roey,Emesh Ismail T.

申请号：

US201614991712

公开号：

US2017200642(A1)

申请日:

2016.01.08

申请国别(地区):

美国

年份:

2017

代理人:

摘要：

In one embodiment of the present disclosure, a method for depositing metal in a feature on a workpiece is provided. The method includes electrochemically depositing a second metal layer on a first metal layer on a workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from the group consisting of cobalt and nickel, wherein the first metal layer completely fills the smallest feature but does not completely fill the largest feature.

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中国工程科技知识中心

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http://www.ckcest.cn/home/