The present disclosure provides a thermal conducting structure applied to a network control automation system. A circuit board defines bare copper regions located at two opposite sides thereof, and copper foil layers are disposed on bare copper regions and cover sliding edges on two side panels to form a thermal conducting path. An accommodation open chamber is formed between outer shell member and two side panels thereof for positioning circuit board, the two side panels of outer shell member have elastic convex parts disposed on surfaces thereof. The circuit module cooperating with positioning structure can be inserted into docking chamber by slidably mounting sliding edge along mounting part from opening, and elastic convex parts are abutted with sidewall around mounting parts to form thermal conducting path, so that heat generated during operation can be conducted to cooler bracket thereby increasing entire heat dissipation area and further improving heat dissipation efficiency.
