The present invention relates to a semiconductor packaging comprising a metal plate, the semiconductor packaging structure comprising: a metal plate having a groove for removal of an electronic element; an electronic element; and a silicon-based adhesive for allowing the electronic element to adhere to the metal plate, wherein the silicone-based adhesive satisfies all of formulas 1 to 3 below: [Formula 1] 1,200 ≤ viscosity (cP) ≤ 1,800; [Formula 2] volatile condensable mass ≤ 0.01 wt%; and [Formula 3] total mass loss ≤ 0.05 wt% (Formula 1 represents a value measured before curing and Formulas 2 and 3 represent values measured after curing; and Formula 1 is measured according to the ASTM D1084 test method and Formulas 2 and 3 are measured according to the ASTM E595 test method).
