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Process for manufacturing a 3D electronic module comprising external interconnection leads
专利权人:
3D PLUS
发明人:
Val Alexandre,Soufflet Fabrice
申请号:
US201615046277
公开号:
US9659846(B2)
申请日:
2016.02.17
申请国别(地区):
美国
年份:
2017
代理人:
Baker & Hostetler LLP
摘要:
A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends. The process comprises the following steps: starting with a lead frame that comprises metal leads, folding by about 180° the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be molded, the other portion, which is what is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a given face cut along Z; depositing on the leads a metal coating; placing the external portion of the frame between two, an upper and lower, protective elements while leaving the internal portion free, and placing the frame and the protective elements on a carrier; placing each stack equipped each with exterior interconnection t
来源网站:
中国工程科技知识中心
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