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Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
专利权人:
MITSUBISHI MATERIALS CORPORATION
发明人:
Maki Kazunari,Ito Yuki
申请号:
US201214349937
公开号:
US9587299(B2)
申请日:
2012.10.26
申请国别(地区):
美国
年份:
2017
代理人:
Leason Ellis LLP
摘要:
This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is given as X at %, an electrical conductivity σ (% IACS) is in a range of σ≦{1.7241/(−0.0347×X2+0.6569×X+1.7)}×100, and a stress relaxation rate at 150° C. after 1,000 hours is in a range of 50% or less.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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